UHV Sputter system

The MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions - we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with...